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Photo courtesy of Hanmi Semiconductor |
[Alpha Biz= Kim Jisun] SEOUL, October 28, 2025 — South Korea’s semiconductor equipment sector is witnessing an escalating legal battle as Hanwha Semitec has filed a patent infringement lawsuit against Hanmi Semiconductor, targeting core technologies used in TC (Thermal Compression) Bonders for HBM (High Bandwidth Memory) manufacturing.
According to industry sources, Hanwha Semitec recently lodged the complaint and appointed Kim & Chang as its legal representative. Both companies currently supply bonding equipment to SK hynix, meaning the outcome could significantly impact manufacturing and sales operations depending on potential injunctions or damages imposed by the court.
The lawsuit is widely viewed as a counteraction to a case filed last December by Hanmi Semiconductor, which accused Hanwha Semitec of technology theft after two former Hanmi engineers allegedly transferred proprietary TC bonder designs to Hanwha upon joining the company.
Hanwha Semitec, however, asserts that its TC bonder technology was developed independently through long-term R&D, and that Hanmi’s HBM3E TC bonder infringes upon Hanwha’s patented components and design structures.
A key issue in the latest lawsuit reportedly concerns specific modules used in the HBM3E-generation TC bonder supplied by Hanmi Semiconductor.
Hanmi Semiconductor responded sharply in an official statement, saying:
“This is a groundless and retaliatory lawsuit. Hanwha Semitec’s countersuit is an audacious act following our legitimate legal action over clear evidence of technology misappropriation.”
Industry observers note that the case could have broader implications for the Korean semiconductor supply chain, particularly as both companies are strategic partners of SK hynix, which leads the global market in HBM3E memory used in advanced AI accelerators and GPUs.
The litigation underscores the rising strategic value of HBM manufacturing equipment, especially TC bonders, which are crucial for stacking DRAM dies with ultra-fine precision to achieve high-speed data processing performance demanded by AI applications.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
