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[Alpha Biz=(Chicago) Reporter Paul Lee] Hanmi Semiconductor, a semiconductor equipment company, first released 'Dual TC Bonder Griffin', a third-generation hyper-model that is a high-bandwidth memory (HBM) essential process equipment that is installed in artificial intelligence (AI) semiconductors.
According to Hanmi Semiconductor on the 29th, dual TC Bonder Griffin equipment will be delivered to global semiconductor companies through shipment.
Hanmi Semiconductor recently announced its goal to forecast annual sales of 450 billion won next year. In addition, the company expects its performance to reach 650 billion won in 2025.
According to foreign sources, NVIDIA, Broadcom and AMD are currently leading HBM demand, but Intel, Google and Amazon also plan to increase procurement of AI semiconductors for servers in the future. As such, it is expected that global semiconductor companies will advance their investment in expanding their post-process (packaged) lines in preparation for soaring demand for HBMs.
On the other hand, Hanmi Semiconductor announced its plan to allocate 420 won per share and a total of 40.7 billion won in fiscal year 2023. It is the largest since its foundation. Hanmi Semiconductor plans to expand its shareholder-friendly dividend propensity in the future.
Alphabiz Reporter Paul Lee(hoondork1977@alphabiz.co.kr)
