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[Alpha Biz=(Chicago) Reporter Kim Jisun] Hanmi Semiconductor made an announcement on the 2nd that it has completed the "Bonder Factory" to expand production facilities for its semiconductor equipment, "Dual TC Bonder."
Dual TC Bonder is a process equipment essential for high bandwidth memory (HBM) production. HBM is produced by stacking several DRAMs vertically and connecting them through 1,024 holes (data channels). Dual TC Bonder is a device that pierces holes in stacked DRAMs.
Hanmi Semiconductor has built a Bond the Factory by utilizing idle space at its third plant in Incheon. The third plant has a large-scale clean room that can assemble and test about 50 semiconductor equipment at once. The company explained that it is the best environment for producing various semiconductor equipment including dual TC bonders.
The expansion of Hanmi Semiconductor coincides with the recent increase in demand for artificial intelligence (AI) semiconductors, including graphics processing units (GPU). As GPU is equipped with HBM, demand for HBM is exploding. Hanmi Semiconductor jointly develops and supplies HBM production equipment with SK Hynix.
Hanmi Semiconductor posted sales of 327.6 billion won and operating profit of 111.9 billion won last year. Semicon China' held in Shanghai last month was the only domestic semiconductor equipment company to participate as an official sponsor.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
