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[Alpha Biz=(Chicago) Reporter Paul Lee] With Samsung Electronics and SK Hynix scheduled to participate in the "Mobile World Congress (MWC)," MWC is expected to be a fierce competition to attract global customers related to artificial intelligence (AI) semiconductors this year.
According to industries on the 16th, Samsung Electronics will participate in the Mobile World Congress (MWC), one of the world's top three electronics and IT exhibitions to be held in Barcelona, Spain, from the 26th to the 29th.
Initially, mobile and telecommunication companies mainly participated in MWC. However, as the AI market expands in earnest this year, such as smartphone on-device AI, semiconductor companies are expected to focus on this MWC.
Samsung Electronics will set up a booth dedicated to semiconductors at this year's MWC to showcase next-generation products such as high bandwidth memory (HBM) and AI semiconductors. In the memory sector, HBM3E, the next-generation (5th generation) product scheduled for mass production in the first half of this year, as well as LPCAMM and GDDR7, which were developed for the first time in the industry, will be unveiled.
The next-generation mobile application processor (AP), Exynos 2400, and the automotive semiconductor Exynos Auto V920 will also be on display.
In the foundry field, 'GAA' technology is introduced directly to major companies in each field.
SK Hynix will not display semiconductor and other products at this MWC, but will prepare a separate private booth.
Through this booth, executives of SK Hynix plan to introduce next-generation semiconductors to global IT and smartphone companies.
In particular, as SK Group Chairman Choi Tae-won is scheduled to attend the MWC, there is a possibility that HBM will attract future customers.
Alphabiz Reporter Paul Lee(hoondork1977@alphabiz.co.kr)
