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Hanmi Semiconductor (Photo = Hanmi Semiconductor) |
[Alpha Biz= Kim Jisun] Hanmi Semiconductor is set to build a new factory for the production of TC bonders, key equipment required for high-bandwidth memory (HBM) manufacturing.
The new TC bonder will be used in the production of the 5th-generation HBM3E 12-stack memory, which is to be supplied to AI semiconductor companies such as NVIDIA and Broadcom. Hanmi Semiconductor plans to expand its TC bonder production capacity, targeting annual revenues of 1.2 trillion won this year and 2 trillion won next year.
On January 6, Hanmi Semiconductor announced the groundbreaking ceremony for the 7th TC bonder factory in Seo-gu, Incheon. The new facility, a two-story building with a total floor area of 14,400 square meters, is expected to be completed by the fourth quarter of this year. The factory will also produce new equipment, including big-die TC bonders for 2.5D packaging, fluxless bonders for 6th-generation HBM (HBM4) production, and hybrid bonders.
The TC bonder applies heat and pressure to connect stacked DRAM chips. Hanmi Semiconductor currently holds the top market share, supplying TC bonders to HBM production companies like SK hynix and Micron. About 90% of the HBM3E 12-stack products used by NVIDIA and Broadcom are produced using Hanmi Semiconductor's TC bonders.
Once the new factory is completed, Hanmi Semiconductor will have a total of 89,530 square meters of HBM TC bonder production facilities, capable of generating annual revenues of around 2 trillion won.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
